The International College of Semiconductor Technology of NCTU is facing 3 major challenges in the semiconductor industry, More Moore, More than Moore, and Beyond CMOS. As a result, we assigned specialized groups to tackle these challenges. The Group of Precision Machinery and Semiconductor is responsible for exploring the limits of Moore’s Law; Group of Heterogeneous Integration and Microsystem Engineering integrates systematic devices which belong to different processes; Group of Solid-state Electronic Devices and Materials focuses on the research and development of solid-state devices for the next generation, so as to catch up with the future trend of semiconductor industry.
1. Group of Solid-state Electronic Devices and Materials
Solid-state devices technologies are the upstream foundation of all semiconductor industries; the groundbreaking and innovative breakthrough of these technologies is undeniably the driving force for the whole electronic industry. The total volume of Taiwan’s domestic semiconductor production is tremendous; this industry not only takes a leading position, but also plays an essential role in the international community. To keep our competitiveness at a certain level, our priority would be talents cultivation. Until today, the semiconductor industry has followed the most dominating principle, Moore’s Law, for 40 some years, and the most advanced device technology is now capable of producing devices in the size of 22 nanometers, which is a great achievement in nano-technologies. However, due to physical limitations, Quantum Effects, interface features, and process variability, the research groups are encountering great challenges in the improvements of scaling and performance.
The goal for our training is to cultivate engineers specialized in emerging solid-state electronic devices. By taking various and professional courses, we wish to cultivate our students into professional in the fields of device design, Quantum physics, material science and nano-process technologies. In addition, we boast prestigious research project teams; our students commit themselves into the fields of emerging solid-state electronic devices. Meanwhile, they are trained to do researches meticulously and creatively.
Research project teams: Nanoscale Si-based Devices, Device Measurement and Simulation, and Emerging Memory Devices.
2. Group of Heterogeneous Integration and Microsystem Engineering
Program of Heterogeneous Integration and Microsystem Engineering encompasses the design and process of Heterogeneous Integration system. Take bio-medical chips technology for example; this domain includes system design, bio and electronic device system integration, chips production, the development of key technologies, and the R&D of integration design platforms.
The goal for our training is to cultivate talents specialized in multiple fields. Hopefully, with the efforts of these talents, we would be able to create a R&D platform which is both reliable and efficient.
Research project teams: The R&D of key process integration technologies, and cross-system simulation and integration.
3. Group of Precision Machinery and Semiconductor Equipment
Precision Machinery can be divided into 3 categories, FEOL equipments, BEOL equipments, and testing equipments. FEOL equipments include wafer fabrication equipment, cleaning equipment, oxidation and diffusion equipment, and photolithography equipment. BEOL equipments include thin film deposition equipment, etching equipment, chemical mechanical polishing equipment, and packing equipment. Testing equipments include film thickness testing equipment, electrical testing equipment, and physical & chemical properties testing equipment. These equipments cover a wide range of designs and systems; for example, vacuum system, mechatronic systems, electronic control systems, mechanical design, simulation, and software development.
The goal for our training is to cultivate domestic talents specialized in semiconductor fabrication and precision machinery. With the effort of these talents, we may be able to independently improve Taiwan’s R&D in the field of advanced semiconductor fabrication and precision machinery.
Research project teams: semiconductor fabrication system, mechanical system, electronic control system, and mechatronic systems.