Orbit

陳 冠能
副院長
姓名 陳 冠能
電子郵件 knchen@mail.nctu.edu.tw
聯絡電話 03-5712121 ext. 31558
研究專長
1.三維積體電路 (3D IC)
2.異質整合技術及元件
3.晶圓接合技術
4.矽晶直通孔 (TSV)
5.晶圓薄化技術
職稱 教授
年度 論文名稱
2016 Yen-Jun Huang, Yen-Hui Hsieh, Jian-Yu Shih, Han-Chun Chen, Jihperng Leu, and Kuan-Neng Chen, Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric, Journal of Nanoscience and Nanotechnology, 16(7), pp. 7546-7550, Jul. 2016
2016 Shih-Wei Lee, Jian-Yu Shih, Kuo-Hua Chen, Chi-Tsung Chiu, and Kuan-Neng Chen, Polymer-Based Liner TSV Fabrication Scheme and Its Resistance Variation, To be published in Journal of Nanoscience and Nanotechnology
2016 Yu-Chen Hu, and Kuan-Neng Chen, A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration, IEEE Journal of the Electron Devices Society, 4(4), pp. 185-188, Jul. 2016
2015 Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, and Kuan-Neng Chen, Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation, IEEE Transactions on Electron Devices, 62(8), pp. 2587-2592, Aug. 2015
2015 [Invited Paper] Chih Chen, Doug Yu, and Kuan-Neng Chen, Vertical Interconnects of Microbumps in 3D Integration, MRS Bulletin, 40(3), pp. 257-263, Mar. 2015
2015 Kuan-Neng Chen, and King-Ning Tu, Materials Challenges in Three-Dimensional Integrated Circuits, MRS Bulletin, 40(3), pp. 219-222, Mar. 2015
2015 Yu-Chen Hu, Chun-Pin Lin, Yao-Jen Chang, Nien-Shyang Chang, Ming-Hwa Sheu, Chi-Shi Chen, and Kuan-Neng Chen, A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electro-less Plating on Chips with Advanced Technology Node, IEEE Transactions on Electron Devices, 62(12), pp. 4148-4153, Dec. 2015
2015 Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Yu-Sheng Hsieh, and Kuan-Neng Chen, Modeling and Characterization of TSV Capacitor and Stable Low Capacitance Implementation for Wide-I/O Application, IEEE Transactions on Device and Materials Reliability, 15(2), pp. 129-135, Jun. 2015
2015 Chien-Min Liu, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and King-Ning Tu, Low-temperature Direct Copper-to-Copper Bonding Enabled by Creep on (111) Surfaces of Nanotwinned Cu, Scientific Reports, 5, 9734, May 2015
2015 Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, Device Characteristics of TSV-Based Piezoelectric Resonator with Load Capacitance and Static Capacitance Modification, IEEE Transactions on Electron Devices, 62(3), pp. 927-933, Mar. 2015
2015 Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Jin-Chern Chiou, A Double-Sided, Single-Chip Integration Scheme Using Through-Silicon-Via for Neural Sensing Applications, Biomedical Microdevices, 17(1), 11, Feb. 2015
2014 Yao-Jen Chang, Yu-Sheng Hsieh, and Kuan-Neng Chen, Submicron Cu/Sn Bonding Technology with Transient Ni Diffusion Buffer Layer for 3DIC Application, IEEE Electron Device Letters, 35(11), pp. 118-120, Nov. 2014
2014 Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang and Kuan-Neng Chen, Quartz Resonator Assembling with TSV Interposer Using Polymer Sealing or Metal Bonding, Nanoscale Research Letters, 9, pp. 541-548, Oct. 2014
2014 Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, and Kuan-Neng Chen, Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement with a Concave Cu TSV Structural Design, IEEE Electron Device Letters, 35(8), pp. 865-867, Aug. 2014
2014 Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and K. N. Tu, Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces, Scripta Materialia, 78-79, pp. 65-68, May 2014
2014 Li-Min Kuo, Yi-Chia Chou, Kuan-Neng Chen, Chien-Chia Lu, and Shuchi Chao, A precise pH microsensor using RF-sputtering IrO2 and Ta2O5 films on Pt-electrode, Sensors and Actuators B: Chemical, 193, pp. 687-691, Mar. 2014
2014 Lei-Chun Chou, Shih-Wei Lee, Po-Tsang Huang, Chih-Wei Chang, Cheng-Hao Chiang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Kuan-Neng Chen, A TSV-Based Bio-Signal Package with μ-probe Array, IEEE Electron Device Letters, 35(2), pp. 256-258, Feb. 2014
2014 Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, and Ho-Ming Tong, 2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications, IEEE Transactions on Biomedical Circuits and Systems, 8(6), pp. 810-823, Dec. 2014
2014 Jian-Yu Shih, Wen-Chun Huang, Cheng-Ta Ko, Zheng Yang, Sheng-Hsiang Hu, Jih-Perng Leu, Keng C. Chou, and Kuan-Neng Chen, Adhesion Investigation between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications, IEEE Transactions on Device and Materials Reliability, 14(3), pp. 914-920, Sep. 2014
2014 Wan-Lin Tsai, Kuang-Yu Wang, Yao-Jen Chang, Yu-Ren Li, Po-Yu Yang, Kuan-Neng Chen, and Huang-Chung Cheng, Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method, Nanoscale Research Letters, 9, pp. 451-456, Aug. 2014
2014 Cheng-Ta Ko, Zhi-Cheng Hsiao, Hsiang-Hung Chang, Dian-Rong Lyu, Chao-Kai Hsu, Huan-Chun Fu, Chun-Hsien Chien, Wei-Chung Lo, and Kuan-Neng Chen, A novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices, IEEE Transactions on Device and Materials Reliability, 14(2), pp. 715-720, Jun. 2014
2014 Lei-Chun Chou, Chih-Wei Chang, Po-Tsang Huang, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuan-Neng Chen, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, and Ho-Ming Tong, A New Fabrication Process for TSV-based Bio-signal Packaging, Storage Management Solutions, 3, pp. 157-168, May 2014
2014 Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, Low-Temperature Bonded Cu/In Interconnect with High Thermal Stability for 3-D Integration, IEEE Transactions on Electron Devices, 61(4), pp. 1131-1136, Apr. 2014
2013 Hsiao-Yu Chen, Sheng-Yao Hsu, and Kuan-Neng Chen, Electrical Performance and Reliability Investigation of Co-sputtered Cu/Ti Bonded Interconnects, IEEE Transactions on Electron Devices, 60(10), pp. 3521-3526, Oct. 2013
2013 Cheng-Hao Chiang, Li-Min Kuo, Yu-Chen Hu, Wen-Chun Huang, Cheng-Ta Ko, and Kuan-Neng Chen, Sealing Bump with Bottom-up Cu TSV Plating Fabrication in 3-D Integration Scheme, IEEE Electron Device Letters, 34(5), pp. 671-673, May 2013
2013 Li-Min Kuo, Kuan-Neng Chen, Yi-Lin Chuang, and Shuchi Chao, Flexible pH-Sensing Structure using WO3/IrO2 Junction with Al2O3 Encapsulation Layer, ECS Solid-State Letters, 2(3), pp. 28-30, 2013
2013 Yao-Jen Chang, Cheng-Ta Ko, and Kuan-Neng Chen, Electrical and Reliability Investigation of Cu TSVs with Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme, IEEE Electron Device Letters, 34(1), pp. 102-104, Jan. 2013
2013 [Invited Paper] Cheng-Ta Ko, and Kuan-Neng Chen, Reliability of Key Technologies in 3D Integration, Microelectronics Reliability, 53(1), pp. 7-16, Jan. 2013
2013 Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Ho-Ming Tong, and Kuan-Neng Chen, Novel Cu-to-Cu Bonding with Ti Passivation at 180C in 3D Integration, IEEE Electron Device Letters, 34(12), pp. 1551-1553, Dec. 2013
2013 Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme with Hermetic Sealing, IEEE Electron Device Letters, 34(8), pp. 1041-1043, Aug. 2013
2013 Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Cheng-Hao Chiang, and Kuan-Neng Chen, Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid Bonding, IEEE Electron Device Letters, 34(3), pp. 435-437, Mar. 2013
2013 Yew Heng Tan, Kwang Sing Yew, Kwang Hong Lee, Yao-Jen Chang, Kuan-Neng Chen, Diing Shenp Ang, Eugene A. Fitzgerald, and Chuan Seng Tan, Al2O3 Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon, IEEE Transactions on Electron Devices, 60(1), pp. 56-62, Jan. 2013
2012 Cheng-Hsien Lu, Chuan-An Cheng, Chia-Hua Ho, and Kuan-Neng Chen, Effects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device Characteristics, Journal of Nanoscience and Nanotechnology, 12, pp. 8050-8054, Oct. 2012
2012 Sheng-Yao Hsu, Hsiao-Yu Chen, and Kuan-Neng Chen, Co-sputtered Cu/Ti Bonded Interconnects with a Self-formed Adhesion Layer for 3D Integration Applications, IEEE Electron Device Letters, 33(7), pp. 1048-1050, July 2012
2012 [Invited Paper] Cheng-Ta Ko, and Kaun-Neng Chen, Low Temperature Bonding Technology for 3D Integration, Microelectronics Reliability, 52, pp. 302-311, Feb 2012
2012 S. Y. Hsu, H. Y. Chen and K. N. Chen, Diffusion of Co-Sputtered Metals as Bonding Materials for 3D Interconnects during Thermal Treatments, Journal of Nanoscience and Nanotechnology, 12, pp.2467-2471, Mar 2012
2012 Kuan-Neng Chen, Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, and Wei-Chung Lo, Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration, Journal of Nanoscience and Nanotechnology, 12, pp.1821-1828, Mar 2012
2012 S. L. Lin, W. C. Huang, C. T. Ko, and K. N. Chen, BCB-to-Oxide Bonding Technology for 3D Integration, Microelectronics Reliability, 52, pp. 352-355, Feb 2012
2012 [Invited Paper] Ya-Sheng Tang, Yao-Jen Chang, and Kaun-Neng Chen, Wafer-Level Cu-Cu Bonding Technology, Microelectronics Reliability, 52, pp. 312-320, Feb 2012
2012 Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang, Peng-Shu Chen, Yu-Jiau Hwang, Huan-Chun Fu, Jui-Hsiung Huang, Chia-Wen Chiang, Shyh-Shyuan Sheu, Yu-Hua Chen, Wei-Chung Lo, and Kuan-Neng Chen, A Wafer-level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Bonding for 3D Memory Application, IEEE Transactions on Device and Materials Reliability, 12(2), pp.209-216, June 2012
2011 K. N. Chen, C. K. Tsang, W. W. Wu, S. H. Lee, and J. Q. Lu, Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications, Journal of Nanoscience and Nanotechnology, 11, pp. 3336-3339, Apr. 2011
2011 [Invited Paper] Kuan-Neng Chen, and Chuan Seng Tan, Integration Schemes and Enabling Technologies for Three-Dimensional Integrated Circuits (3D IC), IET Computers and Digital Techniques, 5(3), pp. 160-168, May 2011
2011 K.N. Chen, A. M. Young, S. H. Lee, and J. -Q. Lu, Electrical Performances and Structural Designs of Copper Bonding in Wafer-Level Three-Dimensional Integration, Journal of Nanoscience and Nanotechnology, 11, pp. 5143-5147, June. 2011
2011 Kuan-Neng Chen, Zheng Xu, and Jiang-Qiang Lu, Electrical Performance and Alignment Investigation of Wafer-level Cu-oxide Hybrid Bonding, IEEE Electron Device Letters, 32(8), pp. 1119-1121, Aug 2011
2011 Sang Hwui Lee, Kuan-Neng Chen, and Jian-Qiang Lu, Wafer-to-wafer Alignment for 3D Integration: An Review, IEEE Journal of Microelectromechanical Systems. 20(4), pp. 885-898, Aug 2011
2011 K. N. Chen, C. A. Cheng, W. C. Huang and C. T. Ko, Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding, Journal of Nanoscience and Nanotechnology, 11, pp. 6969-6972, Aug 2011
2011 Ming-Fang Lai, Shih-Wei Li, Jian-Yu Shih, and Kuan-Neng Chen, Wafer-Level Three-Dimensional Integrated Circuits (3D IC): Schemes and Key Technologies, Microelectronic Engineering, 88, pp. 3282-3286, Nov 2011
2010 Kuan-Neng Chen, and Lia Krusin-Elbaum, The fabrication of a programmable via using phase-change material in CMOS-compatible technology, Nanotechnology, 21 (13), 134001, April 2010
2010 [Invited Paper] Cheng-Ta Ko and Kuan-Neng Chen, Wafer Level Bonding/Stacking Technology for 3D Integration, Microelectronics Reliability, 50 (4), pp. 481-488, April 2010
2010 W.W. Wu, C. W. Wang, K.N. Chen, S. L. Cheng, and S. W. Lee, Enhanced growth of low-resistivity titanium silicides on epitaxial Si0.7Ge0.3 on (001)Si with a sacrificial amorphous Si interlayer, Thin Solid Films, 518, pp. 7279-7282, Oct. 2010
2010 Kuan-Neng Chen, and John C. Arnold, Wafer-level Self-aligned Nano Tubular Structures and Templates for Device Applications, Journal of Nanoscience and Nanotechnology, 10, pp. 8145-8150, Dec. 2010
2010 K.N. Chen, Y. Zhu, W.W. Wu, and R. Reif, Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes, Journal of Electronic Materials. 39(12), pp. 2605-2610, Dec. 2010
2010 W. W. Wu, K. C. Lu, K. N. Chen, P. H. Yeh, C. W. Wang, Y. C. Lin, and Y. Huang, Controlled large strain of Si in the NiSi/Si/NiSi nanowire heterostructure, Applied Physics Letters, 97, pp 203110-1 – 203110-3, Dec. 2010
2008 S. J. Koester, A. M. Young, R. R. Yu, S. Purushothama, K.-N. Chen, D. C. La Tulipe, N. Rana, L. Shi, Matt R. Wordeman, and E. J. Sprogis, Wafer-Level 3D Integration Technology, IBM Journal of Research and Development, 52 (6), pp 583-597, Jul. 2008
2008 K. N. Chen, C. Cabral Jr. and L. Krusin-Elbaum, Thermal stress effects of Ge2Sb2Te5 phase change material: Irreversible modification with Ti adhesion layers and segregation of Te, Microelectronic Engineering, 85, pp 2346-2349, Dec. 2008
2008 K. N. Chen, L. Krusin-Elbaum, D. Newns, B. Elmegreen, R. Cheek, N. Rana, A. Young, S. Koester, and C. Lam, Programmable Via Using Indirectly Heated Phase-Change Switch for Reconfigurable Applications, IEEE Electron Device Letters, 29, pp 131-133, Jan. 2008
2007 L. Krusin-Elbaum, C. Cabral Jr., K. N. Chen, M. Copel, D. W. Abraham, K. B. Reuter, S. M. Rossnagel, J. Bruley, and V. Deline, Evidence for segregation of Te in Ge2Sb2Te5 films: Effect on “phase-change” stress, Applied Physics Letters, 90, pp. 141902-1 – 141902-3, April 2007
2007 [Selected Paper] C. Cabral Jr., K.N. Chen, L. Krusin-Elbaum, and V. Deline, Irreversible modification of Ge2Sb2Te5 phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack, Virtual Journal of Nanoscale Science & Technology, Feb 2007
2007 C. Cabral Jr., K.N. Chen, L. Krusin-Elbaum, and V. Deline, Irreversible modification of Ge2Sb2Te5 phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack, Applied Physics Letters, 90, pp. 051908-1 – 051908-3, 2007
2006 K. N. Chen, S. M. Chang, L. C. Shen, and R. Reif, Investigations of Strength of Copper Bonded Wafers with Several Quantitative and Qualitative Tests, Journal of Electronic Materials, 35(5), pp. 1082-1086, 2006
2006 K. N. Chen, A. Fan, C. S. Tan, and R. Reif, Bonding Parameters of Blanket Copper Wafer Bonding, Journal of Electronic Materials, 35(2), pp 230-234, 2006
2006 [Invited Paper][Review Paper] Kuan-Neng Chen, and R. Reif, Review Paper: Copper Wafer Bonding: Interface Analysis and Characterization, Journal of the Chinese Colloid and Interface Society, 28(1), pp. 1-10, 2006
2005 C. S. Tan, K. N. Chen, A. Fan, and R. Reif, The effect of forming gas anneal on the oxygen content in bonded copper layer, Journal of Electronic Materials, 34(12), pp 1598-1602, 2005
2005 K. N. Chen, C. S. Tan, A. Fan, and R. Reif, Copper Bonded Layers Analysis and Effects of Copper Surface Conditions on Bonding Quality for Three-Dimensional Integration, Journal of Electronic Materials, 34(12), pp 1464-1467, 2005
2005 K. N. Chen, S. M. Chang, L. C. Shen, C. S. Tan, A. Fan, and R. Reif, Processing Development and Bonding Quality Investigations of Silicon Layer Stack Using Copper Wafer Bonding, Applied Physics Letters, 87(3), pp. 031909-1-031909-3, 2005
2005 K. N. Chen, A. Fan, C. S. Tan and R. Reif, Abnormal Contact Resistance Reduction of Bonded Copper Interconnects in 3-D Integration during Current Stressing, Applied Physics Letters, 86(1), pp. 0011903-1-0011903-3, 2005
2005 C. S. Tan, K. N. Chen, A. Fan, and R. Reif, Low temperature direct chemical-vapor-deposition (CVD) oxides to thermal oxide wafer bonding in silicon layer transfer, Electrochemical and Solid-State Letters, 8(1), pp. G1-G4, 2005
2004 Kuan-Neng Chen, Mauro J. Kobrinsky, Brandon Barnett and Rafael Reif, Comparisons of Conventional, 3D, Optical and RF Interconnect for Clock Distribution, IEEE Trans. on Electron Devices, 51(2), pp 233-239, 2004
2004 K. N. Chen, A. Fan, C. S. Tan, and R. Reif, Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology, IEEE Electron Devices Letters, 25(1), pp 10-12, 2004
2004 K. N. Chen, C. S. Tan, A. Fan and R. Reif, Morphology and bond strength of copper wafer bonding, Electrochemical and Solid-State Letters, 7(1), pp G14-G16, 2004
2003 K. N. Chen, A. Fan, C. S. Tan, and R. Reif, Temperature and Duration Effect on Microstructure Evolution during Copper Wafer Bonding, Journal of Electronic Materials, 32(12), pp 1371-1374, 2003
2003 C. S. Tan, A. Fan, K. N. Chen, and R. Reif, Low temperature thermal oxide to Plasma Enhanced Chemical Vapor Deposition oxide wafer bonding for thin film transfer application, Applied Physics Letters, 82(16), pp 2649-2651, 2003
2002 K. N. Chen, A. Fan, C. S. Tan and R. Reif, Microstructure evolution and abnormal grain growth during copper wafer bonding, Applied Physics Letters, 81(20), pp 3774-3776, 2002
2002 K. N. Chen, A. Fan, and R. Reif, Interfacial Morphologies and Possible Mechanisms of Copper Wafer Bonding, Journal of Materials Science, 37(16), pp 3441-3446, 2002
2001 Kuan-Neng Chen, Andy Fan, and Rafael Reif, Microstructure Examination of Copper Wafer Bonding, Journal of Electronic Materials, 30, pp 331-335, 2001
1999 H. H. Lin, K. N. Chen, S. L. Cheng, Y.C. Peng, G.H. Shen, L.J. Chen, and C.R. Chen, Interfacial Reactions of Metal Thin Films on Ion Implanted Silicon under High Current Density, J. Korean Phys. Soc. 35, pp S264-266, 1999
1999 K. N. Chen, H.H. Lin, S.L. Cheng, Y.C. Peng, G.H. Shen, L. J. Chen, C.R. Chen, J.S. Huang, and K.N. Tu, Silicide Formation in Implanted Channels and Interfacial Reactions of Metal Contacts under High Current Density, Journal of Materials Research. 14, pp 4720-4726, 1999
1998 Wen-Ku Chang, Shy-Feng Hsieh, Yuan-Haun Lee, Kuan-Neng Chen, Nan-Chung Wu, A. A WANG, X-ray Diffraction Studies of Phase Transformations Between Tetragonal and Cubic Phases in Ba(Ti,Sn)O3 Systems, Journal of Materials Science, 33(7), pp 1765, 1998
1998 Po-Fu Yen, Kuan-Neng Chen, and Nan-Chung Wu, AlN Films Deposited by RF Magnetron Sputtering Techniques, Proceedings of National Science Council ROC(A) 22, pp. 225-234, 1998
1997 Kuan-Neng Chen, and Nan-Chung Wu, The Research and Manufacturing of the Dielectric Materials in (Ba, Ca)(Ti, Sn)O3 System, Chinese Journal of Materials Science 29, pp. 72-80, 1997
年度 論文名稱
2016 Integration of Neural Sensing Microsystem with TSV-embedded Dissolvable µ-Needles Array, Biocompatible Flexible Interposer, and Neural Recording Circuits, 2016 Symposia on VLSI Technology and Circuits, Honolulu, HI
2014 2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural Sensing Applications, 2014 IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA
2014 3D/2.5D Integration: Development of Key Technologies, Current Applications and Trends, and Research Achievements, 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, Guilin, China
2013 Through-Silicon-Via Based Double-Side Integrated Microsystem for Neural Sensing Applications, 2013 IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA
2010 Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding, 2010 International Electron Devices Meeting (IEDM), San Francisco CA
2009 Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding, 2009 Symposia on VLSI Technology and Circuits, Kyoto, Japan
2008 A 300-mm Wafer-Level Three-Dimensional Integration Scheme Using Tungsten Through-Silicon Via and Hybrid Cu-Adhesive Bonding, 2008 International Electron Devices Meeting (IEDM), San Francisco CA
2006 Structure Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits, 2006 International Electron Devices Meeting (IEDM), San Francisco CA
專書
年度 書名
2013 電子材料導論, 高立圖書
2012 Nonvalotile Memories: Materials, Devices and Applications, Phase Change Materials: Research Developments and Device Applications, American Scientific Publisher
2012 Handbook of Wafer Bonding, Chapter 9 Thermo-Compression Cu-Cu Bonding of Blanket and Patterned Wafers, Wiley VCH
2011 3D Integration for VLSI Systems, Pan Stanford
2011 新世代積體電路製程, 第十三章 三維積體電路製程, 東華書局
2008 Wafer Level 3-D ICs Process Technology, Chapter 6 Cu wafer bonding for 3D-ICs application, Springer
專利名稱 專利編號 專利國別 作者
Semiconductor Device, Manufacturing Method and Stacking Structure Thereof 9,373,564 U.S. Wen-Wei Shen, Kuan-Neng Chen, and Cheng-Ta Ko
Switch array of circuit and system using programmable via structures with phase change materials 20090303786 U.S. Kuan-Neng Chen, and Chung H. Lam
Method of forming programmable via devices 20090111263 U.S. Kuan-Neng Chen, and Sampath Purushothaman
Hermetic Seal and Reliable Bonding Structures for 3D Applications 20080268574 U.S. Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young
Hermetic Seal and Reliable Bonding Structures for 3D Applications 20080124835 U.S. Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young
Method of Forming a Multi-Layer Semiconductor Structure Incorporating a Processing Handle Member 20080064183 U.S. Rafael Reif, Kuan-Neng Chen, Chuan Seng Tan, and Andy Fan
Semiconductor Bonding Structure 9,196,595 U.S. Kuo-Hua Chen, Tzu-Hua Lin, Kuan-Neng Chen, and Yan-Pin Huang
Submicron Connection Layer and Method for Using The Same to Connect Wafers 8,951,837 U.S. Kuan-Neng Chen, Yao-Jen Chang
Bonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric 8,927,087 U.S. Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang
半導體元件之內連接結構 I509758 中華民國 陳冠能, 張耀仁
三維積體電路 I509758 中華民國 譚盎南, 陳宏明, 陳冠能
貫孔式振子裝置晶圓級封裝結構及其製造方法 I498951 中華民國 張祺鐘, 邱智宏, 陳彥崎, 陳冠能, 施建宇
以石墨烯為基底的元件及其製造方法Graphene Channel-Based Devices and Methods for Fabrication Thereof I497644 中華民國 阿弗瑞斯　飛登 Phaedon Avouris, 陳冠能 Kuan-Neng Chen, 法墨　戴蒙 Damon Farmer, 林佑明 Yu-Ming Lin
晶圓次微米接合方法及其接合層 I476839 中華民國 陳冠能, 張耀仁
立體積體電路裝置 I467736 中華民國 陳冠能, 賴明芳, 陳宏明
Graphene Channel-Based Devices and Methods for Fabrication Thereof 8,900,918 U.S. Phaedon Avouris, Kuan-Neng Chen, Damon Farmer, and Yu-Ming Lin
Graphene Channel-Based Devices and Methods for Fabrication Thereof 8,878,193 U.S. Phaedon Avouris, Kuan-Neng Chen, Damon Farmer, and Yu-Ming Lin
Through Silicon Via-Based Oscillator Wafer-level-package Structure and Method for Fabricating the Same 8,766,734 U.S. Chi-Chung Chang, Chih-Hung Chiu, Yen-Chi Chen, Kuan-Neng Chen, Jian-Yu Shih
Graphene Channel-Based Devices and Methods for Fabrication Thereof 8,698,165 U.S. Phaedon Avouris, Kuan-Neng Chen, Damon Farmer, and Yu-Ming Lin
Heterostructure Containing IC and LED and Method for Fabricating the Same 8,679,891 U.S. Kuan-Neng Chen, Cheng-Ta Ko, and Wei-Chung Lo
Integrated Circuit Device 8,653,641 U.S. Kuan-Neng Chen, Ming-Fang Lai, and Hung-Ming Chen
三次元集積回路 5624081 Japan 陳冠能, 李世偉
三維積體電路之接合方法及其三維積體電路 10-1384131 Korea 陳冠能, 徐聖堯
Stacking Error Measurement with Electrical Test Structure Applying 3D-ICs Bonding Technology 10-1373267 Korea 陳冠能, 李世偉
三維積體電路 I443803 中華民國 陳冠能, 李世偉
具有積體電路與發光二極體之異質整合結構及其製作方法 I434405 中華民國 陳冠能, 柯正達, 駱韋仲
三維積體電路之接合方法及其三維積體電路 I433268 中華民國 陳冠能, 徐聖堯
強化氣密性之振子裝置晶圓級封裝結構 I422080 中華民國 陳冠能,羅中倫,藍文安,陽明益
耦合结构及其形成方法 CN 102640314 B 中國 刘小虎, D. 纽恩斯, L. 克鲁辛-伊-鲍姆, G. J. 马丁纳, B. G. 埃尔姆格林, 陈冠能
Bonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric and Structures So Formed 8,617,689 U.S. Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang
Precise-aligned lock-and-key bonding structures 8,603,862 U.S. Kuan-Neng Chen, and Fei Liu
Stacking Error Measurement with Electrical Test Structure Applying 3D-ICs Bonding Technology 8,546,952 U.S. Kuan-Neng Chen, Shih-Wei Li
Heterostructure Containing IC and LED and Method For Fabricating the Same 8,536,613 U.S. Kuan-Neng Chen, Cheng-Ta Ko, and Wei-Chung Lo
Programmable via devices 8,525,144 U.S. Kuan-Neng Chen, and Sampath Purushothaman
Bonding Method for Three-Dimensional Integrated Circuit and Three-Dimensional Integrated Circuit Thereof 8,508,041 U.S. Kuan-Neng Chen, Sheng-Yao Hsu
Method to fabricate high performance carbon nanotube transistor integrated circuits by 3D integration technology 8,455,297 U.S. Phaedon Avouris, Kuan-Neng Chen, and Yu-Ming Lin
Graphene Channel-Based Devices and Methods for Fabrication Thereof 8,445,320 U.S. Phaedon Avouris, Kuan-Neng Chen, Damon Farmer, and Yu-Ming Lin
Three-dimensional integrated circuits and techniques for fabrication thereof 8,426,921 U.S. Solomon Assefa, Kuan-Neng Chen, Yurii A. Vlasov, and Steven J. Koester
Coupling piezoelectric material generated stresses to devices formed in integrated circuits 8,405,279 U.S. Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martna, Xiao Hu Liu, Dennis M. Newns, and Kuan-Neng Chen
Programmable via devices 8,389,967 U.S. Kuan-Neng Chen, and Sampath Purushothaman
Heterostructure Containing IC and LED and Method For Fabricating the Same 10-1259308 Korea Kuan-Neng Chen, Cheng-Ta Ko, and Wei-Chung Lo
ESD Protection Structure for 3D IC 10-1227872 Korea Kuan-Neng Chen, Ming-Fang Lai, and Hung-Ming Chen
三維積體電路的靜電防護結構 I416706 中華民國 陳冠能,賴明芳,陳宏明
改良式振子晶圓級封裝結構 I412167 中華民國 陳冠能,羅中倫,藍文安,陽明益
貫孔式振子裝置晶圓級封裝結構之製造方法 I396311 中華民國 陳冠能,羅中倫,藍文安,陽明益
Precise-Aligned Lock-And-Key Bonding Structures 20140061901 (14/075,699) U.S. Kuan-Neng Chen, Fei Liu
Coupling piezoelectric material generated stresses to devices formed in integrated circuits 8,247,947 U.S. Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martna, Xiao Hu Liu, Dennis M. Newns, and Kuan-Neng Chen
Programmable via devices in back of line level 8,243,507 U.S. Kuan-Neng Chen, Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman
Bonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric 8,241,995 U.S. Kuan-Neng Chen, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang
Methods of forming tubular objects 8,168,542 U.S. Kuan-Neng Chen, John Arnold and Niranja Ruiz
具有凹槽之振子單元封裝結構 M438707 中華民國 張祺鐘, 邱智宏, 陳彥崎, 陳冠能, 施建宇
貫孔式振子裝置晶圓級封裝結構 M437527 中華民國 張祺鐘, 邱智宏, 陳彥崎, 陳冠能, 施建宇
封装载体结构 CN 102623429 中國 林慈桦, 陈国华, 陈冠能
保護型封裝結構及其製造方法 201345147(101115207) Taiwan 張祺鐘, 邱智宏, 陳彥崎, 陳冠能, 施建宇
封裝載體結構 201342552(101111911) Taiwan 林慈樺, 陳國華, 陳冠能
Techniques for three-dimensional circuit integration 8,129,811 U.S. Solomon Assefa, Kuan-Neng Chen, Yurii A. Vlasov, and Steven J. Koester
Scalable transfer-join bonding lock-and-key structures 8,076,177 U.S. Kuan-Neng Chen, and Fei Liu
Four-terminal reconfigurable devices 8,053,752 U.S. Kuan-Neng Chen, and Lia Krusn-Elbaum
Methods of forming features in integrated circuits 8,012,811 U.S. Kuan-Neng Chen, John Arnold, and Niranjana Ruiz
CMOS-process-compatible programmable via device 7,982,203 U.S. Kuan-Neng Chen
Programmable via devices with air gap isolation 7,977,203 U.S. Kuan-Neng Chen, Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman
Programmable via devices in back of line level 7,969,770 U.S. Kuan-Neng Chen, Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman
Techniques for three-dimensional circuit integration 7,955,887 U.S. Solomon Assefa, Kuan-Neng Chen, Yurii A. Vlasov, and Steven J. Koester
Wafer bonded access device for multi-layer phase change memory using lock-and-key alignment 7,927,911 U.S. Matthew J. Breitwisch and Kuan-Neng Chen
Three-dimensional integrated circuits and techniques for fabrication thereof 7,897,428 U.S. Solomon Assefa, Kuan-Neng Chen, Yurii A. Vlasov, and Steven J. Koester
Programmable Via Structure and Method of Fabricating Same 7,888,164 U.S. Kuan-Neng Chen, Lia Krusin-Elbaum, Chung H. Lam, and Albert M. Young
Four-terminal reconfigurable devices 7,880,157 U.S. Kuan-Neng Chen, and Lia Krusn-Elbaum
具有集成电路与发光二极管的异质整合结构及其制作方法 CN 102263097 中國 陈冠能, 柯正达, 骆韦仲
ESD Protection Structure for 3D IC 20120153437 (13/041,358) U.S. Kuan-Neng Chen, Ming-Fang Lai, and Hung-Ming Chen
集積回路と発光ダイオードを備えた異種集積構造及びその製造方法 JP2012-256810A (2011-163255) Japan 陳冠能,柯正達,駱韋仲
CMOS-process-compatible programmable via device 7,811,933 U.S. Kuan-Neng Chen
Hermetic Seal and Reliable Bonding Structures for 3D Applications 7,786,596 U.S. Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young
Four-terminal reconfigurable devices 7,772,582 U.S. Kuan-Neng Chen, and Lia Krusn-Elbaum
CMOS-process-compatible programmable via device 7,687,309 U.S. Kuan-Neng Chen
Hermetic Seal and Reliable Bonding Structures for 3D Applications 7,683,478 U.S. Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young
Programmable via devices with air gap isolation 7,659,534 U.S. Kuan-Neng Chen, Dennis Newns, Sampath Purushothaman, and Lia Krusn-Elbaum
Programmable Via Structure and Method of Fabricating Same 7,652,278 U.S. Kuan-Neng Chen, Lia Krusin-Elbaum, Chung H. Lam, and Albert M. Young
开关单元和开关单元阵列 CN 101304040 B 中國 陈冠能, 林钟汉
可编程相变材料结构及其形成方法 CN 101383337 B 中國 D・m・纽恩斯, L・克鲁辛艾尔鲍姆, 金德起, 陈冠能, 朴炳柱, B・g・埃尔米格林, 林仲汉, C・科桑达拉曼, S・波卢索萨曼
可编程通孔器件及其制造方法和集成逻辑电路 CN 101359649 中國 陈冠能, L・克鲁辛艾保姆, 丹尼斯・m・纽恩斯, 萨姆帕斯・普鲁肖萨曼
可编程通孔器件及其制造方法以及集成逻辑电路 CN 100590861 C 中國 陈冠能, L・克鲁辛艾保姆, 丹尼斯・m・纽恩斯, S・波卢索萨曼
Bonding structure and method of forming the same 20110195273 U.S. Kuan-Neng Chen, Wei-Chung Lo, and Cheng-Ta Ko
接合結構及其製造方法 201128745(99103648) Taiwan 陳冠能,柯正達,駱韋仲
Programmable fuse/non-volatile memory structures in BEOL regions using externally heated phase change material 7,633,079 U.S. Kuang-Neng Chen, Bruce G. Elmegreen, Doek-Kee Kim, Chandrasekharan Kothandaraman, Lia Krusin-Elbaum, Chung H. Lam, Dennis Newns, Byeongju Park, and Sampath Purushothaman
Switch array of circuit and system using programmable via structures with phase change materials 7,608,851 U.S. Kuan-Neng Chen, and Chung H. Lam
Four-terminal programmable via-containing structure and method of fabricating same 7,579,616 U.S. Kuan-Neng Chen, and Chung H. Lam
半导体结构及其制造方法 CN 100567569 C 中國 陈冠能, 林仲汉
使用外部熱相變材料之線後端(BEOL)區域中可程式化保險絲/非揮發性記憶體結構Programmable Fuse/non-volatile Memory Structures in BEOL Regions Using Externally Heated Phase Change Material 200919716(97133775) Taiwan 陳冠能Kuan-Neng Chen, Bruce G. Elmegreen, Doek-Kee Kim, Chandrasekharan Kothandaraman, Lia Krusin-Elbaum, Chung H. Lam, Dennis Newns, Byeongju Park, and Sampath Purushothaman
Method of Forming a Multi-Layer Semiconductor Structure Incorporating a Processing Handle Member 7,307,003 U.S. Rafael Reif, Kuan-Neng Chen, Chuan Seng Tan, and Andy Fan
國家 學校名稱 系所 學位
美國 麻省理工學院 電機工程與電腦科學系 博士
美國 麻省理工學院 材料科學與工程系 碩士
台灣 國立清華大學 材料科學與工程 碩士
台灣 國立成功大學 材料科學與工程 學士
服務機關名稱 單位 職務
國立交通大學 國際半導體產業學院 副院長
美國麻省理工學院 　 訪問科學家
國家晶片中心 專任研究員
國立交通大學 電子工程學系 教授
國家晶片中心 兼任副研究員
日月光/交大 聯合聯發中心 副主任
加拿大英屬哥倫比亞大學 訪問教授
IBM T. J. Watson Research Center 訪問學者
工業技術研究院 特聘技術人員/顧問
新加坡南洋理工大學 訪問學者
國立交通大學 電子工程學系 副教授
IBM T. J. Watson Research Center 研究員
麻省理工學院 微系統實驗室 博士後研究員
INTEL Corporation, Hillsboro, Oregon Component Research Intern
年度 獎項名稱 頒獎單位
2016 電機資訊年輕學者卓越貢獻獎 國立交通大學
2016 第20屆科林論文獎：大學部專題技術報告頭等獎 國立交通大學研發處
2015 傑出人士榮譽獎勵 國立交通大學
2015 優良教學獎 國立交通大學電機學院
2015 績優導師 國立交通大學
2015 青年論文獎 中國電機工程學會
2014 傑出人士榮譽獎勵 國立交通大學
2014 傑出電機工程教授獎 中國電機工程學會
2014 傑出服務獎 台灣電子材料與元件協會
2014 產學技術交流卓越貢獻獎金雕獎 國立交通大學
2014 IMPACT-EMAP 2014: Best Paper Award 台灣電路板協會
2013 傑出人士榮譽獎勵 國立交通大學
2013 績優導師 國立交通大學
2013 第18屆科林論文獎：碩士班論文頭等獎 國立交通大學研發處
2013 青年論文獎第一名 中國電機工程學會
2012 傑出人士榮譽獎勵 國立交通大學
2012 優秀青年電機工程師獎 中國電機工程學會
2012 產學技術交流卓越貢獻獎銅羽獎 國立交通大學
2012 傑出青年教授獎 研華文教基金會
2012 第17屆科林論文獎：大學部專題技術報告優等獎 國立交通大學研發處
2012 第17屆科林論文獎：碩士班論文優等獎 國立交通大學研發處
2011 傑出人士榮譽獎勵 國立交通大學
2011 產學技術交流卓越貢獻獎銅羽獎 國立交通大學
2011 傑出青年教授獎 研華文教基金會
2011 第16屆科林論文獎：大學部專題技術報告優等獎 國立交通大學研發處
2010 傑出青年獎 台灣電子材料與元件協會
2010 傑出青年教授獎 研華文教基金會
2008 Invention Achievement Award IBM
2007 Invention Achievement Award IBM
2006 Invention Achievement Award IBM
Phi Tau Phi Scholastic Honor Society